Check out the heatsinkcalculator if you need to evaluate these smaller heat sources.
Calculation of surface area of heatsink.
E lateral edge length.
It is assumed that all surfaces of the heat sink are gray and.
The p rocedure for calculating the radiative heat transfer coefficient for the u channels is outlined in the book by ellison ref.
Concentration of the heat source over an area much smaller than heat sink base is not taken into account in this calculator.
Is the convection coefficient of the heat sink is the total surface area of the heat sink is the temperature of the source being cooled is the ambient temperature.
Plate fin heat sink attached to a printed circuit board continue.
The metal surface is supposed to be untreated shiny metal colour and the thickness should exceed 1 5 mm.
The stefan boltzmann constant σ has a value of 5 67 10 8 w m 2 k 4.
The surface area of a square pyramid is comprised of the area of its square base and the area of each of its four triangular faces.
Heat sink sizing calculator v4.
Krug december 2015.
P perimeter of the fins.
This temperature is commonly higher than the temperature of the device s exterior and its case.
Lateral sa 2a a 2 2 h2.
H air film convective coefficient a exposed surface area of the fins.
Applications of a heat sink calculator.
Please use our online heat sink calculator for this step.
Heat sink design and optimization i.
Estimate the overall volume of the heat sink required to cool a heat source by using the following equation.
2 u channel interior surface identification 4.
Base sa a 2.
Heat sink sizing calculator rough estimate.
The variables ε is the surface emissivity of the heat sink.
Where a hs is the surface of the metal plate in cm 2 and r th hs a is the thermal resistance from the heat sink to the ambient in c w.
S tot total surface area.
Next the radiation heat transfer from the area a 2 given by equation 10 is calculated.
S slant height.
The heat transferred from the junction to case multiplied by the junction case.
A side length.
S lat lateral surface area.
Fins are used to increase heat transfer area and provide a cooling effect.
Typical values are listed in the article the importance of radiation in heat sink design.
The highest operating temperature that a semiconductor in an electronic device can withstand is called its junction temperature.
Given height h and edge length a the surface area can be calculated using the following equations.
This calculator should not be used in instances where the heat source is much smaller than the base of the heat sink.
Heat transfer by convection of a heat sink with fins calculator and equations.
